UNLOCKING THE NEW POTENTIAL OF AI AND HPC: AYAR LABS’ TECHNOLOGY

High performance computing and artificial intelligence have become key strategic technologies for innovation in fields such as science, medicine, business, and defense. However, the growth of HPC and AI systems is increasingly constrained by interconnect bottlenecks, power limitations, and costs. Electrical I/O technologies such as copper wires and pluggable optical modules cannot provide the required bandwidth density, energy efficiency, latency, and scalability for future systems. Ayar Labs has developed a groundbreaking solution for this issue: TeraPHY optical I/O technology. TeraPHY integrates electronic and optoelectronic devices on silicon chips, which can be integrated into standard chip packages. In addition, with Ayar’s SuperNova multi wavelength light source, TeraPHY can achieve direct optical connection between chips, providing high bandwidth, ultra-low latency, and power efficiency that electrical I/O cannot match.

 

Overview of TeraPHY Optical I/O Technology
Ayar Labs’ TeraPHY optical I/O chip uses proprietary single-chip manufacturing processes to integrate electronic and optoelectronic devices on CMOS compatible silicon substrates. This enables high-density integration of high-speed optical I/O ports next to electronic chips within standard chip packages.

 

The TeraPHY chip works together with Ayar’s SuperNova multi wavelength laser source, which can be remotely placed and coupled to the chip package through fiber optic cables. This provides a complete optical I/O solution: SuperNova generates light of multiple wavelengths, while TeraPHY modulates and receives the light to transmit and receive data.

 

The key features and advantages of TeraPHY I/O solution include:

Extreme bandwidth density: Each chip can achieve a bandwidth of 2 Tbps, or 200 Gbps per chip edge, which is 1000 times higher than electrical I/O;

·Ultra low latency: 5 ns per chip, 10 times faster than electrical I/O, achieving real-time processing;

·High energy efficiency:< 5 pJ/bit, 10 times more efficient than electrical I/O, can reduce power consumption and cooling costs;

·Flexible transmission distance: from chips to racks, millimeters to kilometers;

·High reliability: compliant with GR-468 standard, resistant to noise EMI、 Voltage fluctuations have anti-interference properties.

TeraPHY and SuperNova provide the capacity, speed, efficiency, and robustness required for next-generation HPC and AI systems to overcome interconnect bottlenecks.

 

Innovate HPC and AI systems

The extremely high bandwidth density and low latency of Ayar optical I/O technology can achieve a revolutionary leap in HPC and AI application performance:

·Train complex AI models (such as GPT-3) in hours instead of weeks;

·Reduce HPC workload time by 10 times or more;

·Implement real-time AI inference for critical applications;

·Horizontally expand AI and HPC systems to increase capacity.

Specific use cases that can benefit from TeraPHY optical I/O include:

·Connect GPU/TPU arrays for large-scale parallel AI training and inference;

·Low latency connection to CPU, memory, storage, accelerator, and network;

·Decoupling calculation of rack scale with flexible resource pool;

·Interconnection between HPC, network, and embedded processor chips;

·Next generation wireless, LiDAR, and satellite networks.

 

The extreme bandwidth capacity of a single TeraPHY chip (2 Tbps) can replace hundreds of electrical I/O or fiber optics. This reduces costs, complexity, and power consumption. By encapsulating the economy, performance, and flexibility of optics through group contracts, Ayar’s solution helps make real-time AI, personalized medicine, smart radio, and other future applications possible and easy to explore.

 

The key advantage of optical I/O – reliability

Compared to electrical I/O, Ayar Labs’ TeraPHY optical I/O solution has inherent reliability and robustness advantages:

·Protect from electromagnetic interference that can damage electrical signals;

·Lower thermal resistance; Better heat dissipation;

·Resistant to power noise and fluctuations;

·Compliant with GR-468 standard, ensuring the reliability of optoelectronic devices in extreme environments;

·Single chip integration reduces defects compared to assembling discrete components.

 

By transmitting optical signals instead of electrical signals over copper wires, optical I/O avoids many common fault mechanisms in HPC and network systems. This improves normal operating time, reduces maintenance costs, and extends the lifespan of the system.

WHAT IS COC TECHNOLOGY AND WHAT IS THE USE OF THIS PACKAGING

COC technology is a packaging technology that directly attaches chips to a carrier, also known as a packaging substrate or packaging carrier board. It can be a certain ceramic material or special plastic. It is a bridge between bare chips and external circuits, and an important component of optoelectronic ICs.

 

The middle part of the picture shows the CHIP (bare chip) of SOA, which is fixed on a ceramic substrate (carrier) using special adhesive or eutectic technology. The gray part in the figure. Coat the empty part of the carrier with a metal thin film, as shown in the golden yellow part at corner 4 of the figure. By threading a gold wire between the electrode of CHIP and the metal film, the metal film becomes a relay island for circuit connection. This creates a COC shaped SOA. SOA in COC form has a small volume, light weight, and is easy to package later. Or provide other optical device manufacturers with their own application and design ideas, and package them with other micro active and passive optoelectronic devices to form new photonic integrated circuits. This can significantly reduce the packaging difficulty and cost for optical device manufacturers, shorten the development cycle of new products, and effectively improve the integration and reliability of optoelectronic devices. COC technology is widely used in fields such as microwave and radio frequency, optoelectronics, and sensors, and is an important packaging technology.

 

As for why SOA needs to have a supply form like COC, it is determined by the characteristics of optoelectronic semiconductors and packaging processes. Pure electric semiconductors, with only the flow of electrons, can be made very small with a diode or transistor, and billions of chips can be made on a CHIP, such as our common IC integrated circuits such as CPUs and memory. But optoelectronic semiconductor chips are different. In addition to electrons, they also have photon motion inside. In order to generate more photons, the volume of optoelectronic semiconductor diodes is often made larger. And the doping elements of optoelectronic chips with different functions are different, and the internal structure differences are also significant. In this way, optoelectronic chips often appear as independent entities. In order to connect the optical paths of active or passive optical devices with different characteristics, the chip needs to be lifted to a certain height, which is provided by the carrier in COC. In this way, COC has become a form of supply for optoelectronic semiconductors such as SOA.

SHENZHEN ACEC CABLE CO.,LTD ATTEND THE 29TH CCBN IN BEIJING

SHENZHEN ACEC CABLE CO.,LTD participated in the 29th China International Radio and Television Information Network Exhibition (CCBN2023) held at the Shougang International Convention and Exhibition Center in Beijing from April 19 to 21, 2023.

At the exhibition, SHENZHEN ACEC CABLE CO.,LTD showcased outdoor fiberoptical cable, indoor optical cable, patch cord, optical splitters, optical terminal equipment and ADSS fittings, all are FTTX and 5G solutions with products.

 

At the exhibition, there are more than 50 potential customers who are interested in the fiber optical products, some customers send enquiries after the talking on the exhibition, it is mainly on fiber optical cables and patch cord, We also give some samples and brochures to them, we will follow up these customers and give them quotation accordingly.

 

Aceccable — Your reliable Optical-Cable solution provider.
Aceccable — Leading Optical-cable manufacturing technology .
Aceccable — Efficiency achievements brand, honesty cast the future.

GSMA: 5G WILL BECOME THE MOST MAINSTREAM MOBILE TECHNOLOGY NEXT

Recently, GSMA released its annual report “China Mobile Economy Development 2023”, which introduces the latest milestones in the development of China’s mobile industry. According to GSMA estimates, mobile technology and services contributed 5.5% of China’s GDP in 2022, equivalent to $1.1 trillion in economic added value. It is expected that by 2025, China will become the first market with 1 billion 5G connections.

 

The report China Mobile Economic Development 2023 shows that Chinese Mainland is the world’s largest 5G market, and the number of 5G connections has exceeded 60% of the global total by the end of 2022. In 2022, China built 887000 5G base stations, and by the end of 2022, the number of 5G base stations in China had exceeded 2.3 million.

 

GSMA predicts that 5G will surpass 4G as the most mainstream mobile technology in China by 2024. The industry organization also pointed out that the mainstream adoption of 4G and 5G in China means that traditional networks (2G and 3G) are currently being gradually phased out. Although most users have migrated to 4G and 5G, traditional networks continue to support various IoT services. However, it is estimated that by 2025, China’s traditional networks may be almost completely shut down.

The report also predicts that by 2028, China’s smartphone data traffic will more than double. GSMA points out that China’s mobile traffic growth is driven by various factors, mainly video live streaming, live streaming e-commerce, and online gaming. 5G is also a major driving factor for the growth of mobile data traffic, as evidenced by the increasing proportion of this technology in the total mobile data traffic.

 

In terms of the Internet of Things, GSMA predicts that the number of authorized spectrum cellular IoT connections in China will double to 3.6 billion by 2030. By 2030, China’s authorized spectrum cellular IoT connections will account for 67% of the global total.

 

This report points out that the large-scale construction of 5G networks in the past few years has led to record levels of capital expenditure intensity in China. As operators shift their focus to creating investment returns, overall capital expenditure will begin to decline in the coming years. During the period of 2023-2030, Chinese operators will invest $291 billion in their own networks, most of which will be used for 5G.

 

The GSMA stated that China’s mobile ecosystem created 6 million job opportunities in 2022. By 2030, the contribution of the mobile industry to the Chinese economy will reach approximately $1.3 trillion, and 5G is expected to bring $290 billion in benefits to the Chinese economy, accounting for over 22% of the total impact of the mobile industry on the economy. Most of the profits will be realized within the next 5 years.

 

Operators are fully seizing the enterprise level opportunities of 5G: With a large number of consumers starting to use 5G, the focus of Chinese operators is increasingly shifting to 5G enterprise services. Operators also readjust their enterprise strategies accordingly to improve customer service quality, including adjusting their 5G value proposition to edge computing and network slicing with the expansion of 5G SA networking deployment. The GSMA points out that the proportion of revenue other than network connectivity among global operators varies greatly, ranging from 15% to 40% of total revenue. In China, operators have made significant progress in diversifying their revenue. However, due to the large scale of mobile services that dominate the revenue structure, the proportion of revenue other than network connectivity to total revenue still ranks among the lowest globally.

 

The development momentum of dedicated 5G is strong: the report states that China has been at the forefront of dedicated 5G development worldwide. The GSMA stated that national support and cooperation between mobile operators and local equipment suppliers such as Huawei and ZTE have laid the foundation for the growth of dedicated 5G. To maintain the development momentum, solutions need to lower prices and make installation and operation more convenient and efficient. This has driven the growing demand for pre packaged solutions, which include service management tools and billing systems, edge and cloud integration, as well as mechanisms for handling data authentication and security.

 

Innovation supports China’s digital goals: The report points out that the digital ecosystem, including startups, will be the vanguard force in achieving China’s digital goals. In 2022, the United States added 182 new unicorn companies, accounting for more than half of the 330 new unicorn companies worldwide, followed closely by China with 74 new unicorn companies. About 70% of the newly added unicorn companies in China come from four fields: clean technology, renewable energy, healthcare, and intelligent logistics. More than 10 semiconductor companies also made it onto the list, while other industries such as automotive transportation, intelligent manufacturing, gaming, and metaverse also had companies on the list.

 

Financial technology provides opportunities for mobile industry enterprises: The report states that in the past decade, China has been at the forefront of financial technology services, largely due to investments in an increasingly diverse range of products and the growing demand for electronic payment methods. Network connectivity is the main driving factor for fintech services. The increasing attention to peripheral fields such as big data, artificial intelligence, and cloud computing will enable telecommunications operators to obtain greater value through financial technology. Some operators are also playing a more active role in the fintech field through direct investment and partnerships.

 

China’s shift towards circular economy: GSMA points out that the benefits of circular economy and its necessity for telecommunications equipment will dominate in 2023 and beyond. The transition to sustainable development requires all industries to examine their own resource utilization methods. This is particularly crucial for growing industries such as telecommunications. The Chinese government has recognized the importance of circular economy and incorporated its principles into the 14th Five Year Plan. Chinese terminal and equipment suppliers have joined the transition to a circular economy.